Cr Sputtering Target

Manufacturing Process: Hot Isostatic Pressing

Specification : Length: <4000mm, OD:<300mm

Relative Density > 99.0%

Purity : 99.5% ~ 99.8%

Grain Size <50 um

Ti Sputtering Target

Manufacturing Process: Vacuum melting technology

Specification : Length: <4000mm, OD:<300mm

Purity : 99.7% ~ 99.999%

Al and Cu Sputtering Target

Manufacturing Process: Vacuum melting technology

Specification : Length: <4000mm, OD:<300mm

Purity : 99.99% ~ 99.999%

Other materials